Web赛元sc92f7323单片机 通用mcu芯片 sop-28封装 可代写程序烧录,28pin,1t 8051内核flash mcu,512b sram,8kb flash,128b独立eeprom,12位adc,3路8+2位pwm,3个定时器,uart,软件lcd,stop mode电流<1ua WebOct 25, 2024 · TSSOP——Thin Shrink SOP. SSOP与SOP封装的最明显的区别在于SOP封装的引脚间距为1.27mm(图1中的参数G),而在SSOP中引脚间距为0.65mm;TSOP与SOP封装的最明显的区别在于封装器件的高度参数(图1中的参数C)不同,所谓的TSOP嘛,T是thin的简称,瘦一点,这个高肯定要矮 ...
P-TSSOP-28-2 - Infineon Technologies
WebDownload package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. WebBody Length (mm) 9.7: Body Width (mm) 4.4: Min. Terminal Pitch (mm) Diagrams. Footprint Dimensions flu injection chemist warehouse
TSSOP20 Package & Packing Information Toshiba Electronic …
Web瑞萨电子 时钟缓冲器, 28引脚, TSSOP-28封装. RS 库存编号 216-6250. 制造商零件编号 9DB433AGLFT. 制造商 Renesas Electronics. WebFeb 24, 2013 · The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. It has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. The TSSOP come in body sizes of 3.0mm, 4.4mm and 6.1mm. Web找stc15w404as-35i-tssop28规格参数技术文档,厂家,现货等,上阿里巴巴ic专业市场。为你找到54条stc15w404as-35i-tssop28型号,品牌,封装,批号,价格,图片等信息,批发采购stc15w404as-35i-tssop28,上阿里巴巴1688 ic频道。 flu in indiana